ORIGINAL: ianober
I was under the impression that essentially if you use peel ply then the inner surface is ready for bonding, no scuffing necessary Oliver? Isn't the purpose of the peel ply to remove the waxy surface layer that forms when the epoxy cures ?
Yes absolutely Ian.
The purpose of the peel ply in the sandwich process is not to remove the waxy surface but to isolate the bidim from the absorbing falter so that you can remove everything when the bonding is completed. The grainy surface is only a consequence of that.
However if you look at the pictures provided by Marc, it looks like the inner layup was laid down by hand ( technical choice ). In that case the inner layup has to be prepared before the gluing process, of course.